X-SERIES
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• High Defect Detection
• Low False Calls
• Fast Throughput
• Quick Set-up
• Automated 3-D Inspection
YESTech’s versatile X-Series Automated X-Ray
Inspection Systems(AXI) offer complete
inspection of solder joints and other critical hidden
features found in electronic assemblies, PCB’s
and packaged semiconductors. Ideal for in-line
or off-line operation, the X-Series’ innovative
algorithms enable fast and reliable automated inspection and real-time monitoring of critical
process information.
The X-3 3-D system permits users to discriminate between
the top and bottom sides of boards where there is a high-density
of solder joints. YESTech’s 3-D capability separates the top
and bottom images of double sided boards for unimpeded
automated inspection of solder joints.
Automated Inspection for:
• Opens & shorts
• Insufficent / excess
solder
• Lifted leads
• BGA
• Voids
• Component presence
and position
Katalog |
